Introduction to ceramics W D Kingery; H Kent Bowen; D R Uhlmann
Material type:
TextLanguage: English Series: Wiley series on the science and technology of materialsPublication details: New York : Wiley, ©1976.Edition: 2d edDescription: xii, 1032 pages : illustrations ; 24 cmISBN: - 9788126539994
- 666 KIN
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CUTN Central Library Medicine, Technology & Management | Non-fiction | 666 KIN (Browse shelf(Opens below)) | Available | 32724 | |
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CUTN Central Library Medicine, Technology & Management | Non-fiction | 666 KIN (Browse shelf(Opens below)) | Available | 32725 | |
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CUTN Central Library Medicine, Technology & Management | Non-fiction | 666 KIN (Browse shelf(Opens below)) | Available | 32726 | |
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| 666 KIN Introduction to ceramics | 666 KIN Introduction to ceramics | 666 KIN Introduction to ceramics | 666 KIN Introduction to ceramics | 666 KIN Introduction to ceramics | 666 KIN Introduction to ceramics | 667.205 DEL Dyes and pigments |
This 2nd edition of Introduction to Ceramics has been printed 15 years after the 1st edition. Many advances have been made in understanding and controlling and developing new ceramic processes and products. this text has a considerable amount of new material and the product modification.
1. Ceramic processes and products --
II: Characteristics of ceramic solids --
2. Structure of crystals --
3. Structure of glass --
4. Structural imperfections --
5. Surfaces, interfaces, and grain boundaries --
6. Atom mobility --
III: Development of microstructure in ceramics --
7. Ceramic phase-equilibrium diagrams --
8. Phase transformation, glass formation, and glass-ceramics --
9. Reactions with and between solids --
10. Grain growth, sintering, and vitrification --
11. Microstructure of ceramics --
IV: Properties of ceramics --
12. Thermal properties --
13. Optical properties --
14. Plastic deformation, viscous flow, and creep --
15. Elasticity, anelasticity, and strength --
16. Thermal and compositional stresses --
17. Electrical conductivity --
18. Dielectric properties --
19. Magnetic properties.
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